Evaluation Findings of Bondade CU-31 Bonding Solution

Evaluation Findings of Bondade CU-31 Bonding Solution

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Prepared by the Highway Innovative Technology Evaluation Center (HITEC), a CERF Service Center. The report describes a HITEC evaluation of Bondade CU-31 Bonding Solution, manufactured by Transpo Industries. The reportA˜describes a three-year program of field testing and evaluation designed to determine the effectiveness of Bondade CU-31 in extending the service life of pothole repairs.The Evaluation Plan called for performance monitoring to continue for the lesser of (a) the life of the repairs, (b) the time to ... will continue to be monitored by the participating agencies (notably, the more than 150 repairs still in place in the City of Cincinnati). ... A strong bond is also needed between the base of the repair and the pavement to resist shearing stresses that can cause dishing and shoving.


Title:Evaluation Findings of Bondade CU-31 Bonding Solution
Author: Highway Innovative Technology Evaluation Center (U.S.)
Publisher:ASCE Publications - 1998-01-01
ISBN-13:

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